Please use this identifier to cite or link to this item: http://148.72.244.84/xmlui/handle/xmlui/4653
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dc.contributor.authorHind.W Abd Allah-
dc.date.accessioned2023-10-18T07:55:35Z-
dc.date.available2023-10-18T07:55:35Z-
dc.date.issued2017-
dc.identifier.citationhttp://dx.doi.org/10.24237/djps.1301.155Aen_US
dc.identifier.issn2222-8373-
dc.identifier.urihttp://148.72.244.84:8080/xmlui/handle/xmlui/4653-
dc.description.abstractIn this research the thermal conductivity of the epoxy resin composites had studied characterized as operating particle size of filler. SiO2 and MgO are used as filler with three different particle size (37,75 and 125μm) with volume fraction of 5%. Hybrid composite samples of both filler were prepared using same value of 2.5% of both in composite. The result shown enhancement in thermal conductivity value of composites compares with the pure and incensement with decreased the grain size of particles additives as a nonlinear relationship. The result given away thermal conductivity of EP/MgO composites better than the thermal conductivity EP/ SiO composite. The hybrid composite samples gives high values of thermal conductivity comparing with (Ep/MgO, EP/SiO2) alone for all particle size.en_US
dc.description.sponsorshiphttps://djps.uodiyala.edu.iq/en_US
dc.language.isoenen_US
dc.publisheruniversity of Diyalaen_US
dc.subjectThermal conductivity, epoxy, filler, hybrid particulate composites, particle sizeen_US
dc.titleStudying the Particle Size Effect on Thermal Conductivity for Hybrid Particulate Compositeen_US
dc.typeArticleen_US
Appears in Collections:مجلة ديالى للعلوم الاكاديمية / Academic Science Journal (Acad. Sci. J.)

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