Please use this identifier to cite or link to this item: http://148.72.244.84/xmlui/handle/xmlui/8565
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dc.contributor.authorIntessar K.Abd-
dc.date.accessioned2023-11-08T07:04:40Z-
dc.date.available2023-11-08T07:04:40Z-
dc.date.issued2014-
dc.identifier.issn2222-8373-
dc.identifier.urihttp://148.72.244.84:8080/xmlui/handle/xmlui/8565-
dc.description.abstractIn this paper a statistical analysis was studied, the different between wet and dry etching was analysis by using Chi-Square distribution. The statically result show that dry processes have etch rates with anisotropic etching more than wet etching process .These results were agree with published data and researches resultsen_US
dc.description.sponsorshiphttps://djps.uodiyala.edu.iq/en_US
dc.language.isoenen_US
dc.publisheruniversity of Diyalaen_US
dc.subjectWet etching ,Dry etching,Statistical analysisen_US
dc.titleStatistical Analysis study different between wet and dry etchingen_US
dc.typeArticleen_US
Appears in Collections:مجلة ديالى للعلوم الاكاديمية / Academic Science Journal (Acad. Sci. J.)

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